Laser Micro-cutting Systems | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.
These machines performs cutting precisely to achieve the application goals with stable quality and low thermal effects.. Hortech's custom designed laser micro-cutting machines can cut both ultracompact materials and hard, brittle materials in heterotypic shapes with low thermal effects and without crater residues. They achieve high aspect ratio and high verticality. They can cut composite materials and creates added values. Hortech Co. is a high-quality Laser Micro-cutting Systems, Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling manufacturer from Taiwan since 2006. With more than 27 years experience, Hortech Co. is professional provider of laser equipment and OEM solutions.
Laser Micro-cutting Systems
These machines performs cutting precisely to achieve the application goals with stable quality and low thermal effects.
Hortech's custom designed laser micro-cutting machines can cut both ultracompact materials and hard, brittle materials in heterotypic shapes with low thermal effects and without crater residues. They achieve high aspect ratio and high verticality. They can cut composite materials and creates added values.
Ultrafast SiC Wafer Dicing Laser Machine
Hortech has successfully developed the precision laser machine that can dice SiC wafers at high...
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Laser Micro-cutting System for Flexible Substrates
This laser micro-cutting system for flexible substrates is designed to cut flexible materials...
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2D Sheet Metal Precision Laser Cutting Machine
Traditional laser cutting techniques do not take the precision into consideration. They roughly...
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Laser Micro-cutting Systems | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.
Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-cutting Systems, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.
Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.
Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.