Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Purchase Laser Micro-Cutting | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Hortech Co. is a high-quality Laser Micro-Cutting, Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling manufacturer from Taiwan since 2006. Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Laser Micro-Cutting Searched | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

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Laser Micro-cutting Systems
Laser Micro-cutting Systems

Hortech's custom designed laser micro-cutting machines can cut both ultracompact materials...

Diamond Saw Blades
Diamond Saw Blades

The diamond saw blade of a machine tool needs to be manufactured with high precision. Otherwise,...

Laser Micro-cut Thermal Conductive Indium Foil in Processors
Laser Micro-cut Thermal Conductive Indium Foil in Processors

Thermal conductive indium foil in processors needs to be cut. The temperature of 5G-related...

Laser micro-cut & micro-drilled thin films
Laser micro-cut & micro-drilled thin films

Thin films encompass metal materials and organic materials. Their thickness is between monoatom/single...

Ultrafast DUV Laser with Large Power - Thin Wafer-dicing
Ultrafast DUV Laser with Large Power - Thin Wafer-dicing

The laser with DUV wavelength can gasify and lift off the material by extremely high photon...

Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer
Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer

Employing conventional processes to dice thick silicon wafers, including direct laser cutting...

Precision Laser Micro-cutting
Precision Laser Micro-cutting

Precision laser micro-cutting can produce fine widths. Materials that require micro-cutting...

Micro-Drilled and Micro-cut, Shielded PI
Micro-Drilled and Micro-cut, Shielded PI

Micro-drilling and micro-cutting PI materials can stand against thermal expansion. They are particularly...

Laser Cutting PI Substrates
Laser Cutting PI Substrates

Applications of flexible circuit boards have become more diverse as the popularity of products...

Laser Cutting Plastic Light Guide Plates for Vehicles
Laser Cutting Plastic Light Guide Plates for Vehicles

Employing the laser to cut light guide plates not only solves the dust problem resulting from...

Laser cutting Composite Materials in Heterotypic Shapes for Vehicles
Laser cutting Composite Materials in Heterotypic Shapes for Vehicles

Many high-quality composites have been adopted to replace alloy to manufacture vehicles. These...

Laser cutting Aluminum Sheets for Electric Vehicle Batteries
Laser cutting Aluminum Sheets for Electric Vehicle Batteries

Employing traditional die cutting to process the metal sheet installed in the battery suffers...

Result 1 - 12 of 33

Laser Micro-Cutting | Taiwan Laser Processing Services & Laser Engraving Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-Cutting, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.