Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employing conventional processes to dice thick silicon wafers, including direct laser cutting and stealth cutting in the backend packaging processes, results in the stress and dust that damage the surface. To solve the above problems, Hortech launches new techniques that employ the following processes. First, coat silicon wafers with protective films, just like shielding masks, and then perform grooving on protective films by employing the DUV focused laser beam with linewidth. This can save the complicated grooving and photomasking required by exposure and development in the photolithography process. Second, employ the highly vertical plasma to cut through grooves by micro-etching, which can successfully cut thick wafers. Hortech Co. is a high-quality Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer, Employ the DUV laser to cut thick silicon wafers with high crystal density, resulting in narrow grooves. The wafers do not suffer from the damages caused by the stress. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Wafer dicing, wafer laser micro-cutting, Si wafer, silicon wafer / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employ the DUV laser to cut thick silicon wafers with high crystal density, resulting in narrow grooves. The wafers do not suffer from the damages caused by the stress. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer - Employ the DUV laser to cut thick silicon wafers with high crystal density, resulting in narrow grooves. The wafers do not suffer from the damages caused by the stress.
  • Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer - Employ the DUV laser to cut thick silicon wafers with high crystal density, resulting in narrow grooves. The wafers do not suffer from the damages caused by the stress.

Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer

Wafer dicing, wafer laser micro-cutting, Si wafer, silicon wafer

Employing conventional processes to dice thick silicon wafers, including direct laser cutting and stealth cutting in the backend packaging processes, results in the stress and dust that damage the surface. To solve the above problems, Hortech launches new techniques that employ the following processes. First, coat silicon wafers with protective films, just like shielding masks, and then perform grooving on protective films by employing the DUV focused laser beam with linewidth. This can save the complicated grooving and photomasking required by exposure and development in the photolithography process. Second, employ the highly vertical plasma to cut through grooves by micro-etching, which can successfully cut thick wafers.

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Employ the DUV laser to perform shielded direct-writing grooving and plasma silicon wafer-dicing that achieve high vertical and narrow grooves


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Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Ultrafast DUV Laser with Large Power - Laser Grooving and Plasma Vertical Cutting Through Sicilon Wafer, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.