Laser Micro-Cutting for Thermal Conductive Indium Foil / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Hortech employs precision laser to cut the thermal conductive material - indium foil / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser Micro-cut Thermal Conductive Indium Foil in Processors - Hortech employs precision laser to cut the thermal conductive material - indium foil
  • Laser Micro-cut Thermal Conductive Indium Foil in Processors - Hortech employs precision laser to cut the thermal conductive material - indium foil

Laser Micro-cut Thermal Conductive Indium Foil in Processors

Laser Micro-Cutting for Thermal Conductive Indium Foil

Thermal conductive indium foil in processors needs to be cut. The temperature of 5G-related products, CPU, and image processing chips increases when they operate in high speed. If the temperature cannot be properly expelled, their performance and functionality decrease. Thermal conductive pads play an important role in solving the above problem. The highest thermal conductivity that indium foil can achieve is 80W/m-k. Thus, it is the best material because its thermal conductivity is 20 - 30 higher than thermal pads made of other materials. Hence, indium foil serves as a cost-effective solution that can significantly enhance the performance and functionality of high-speed processors or components.

Laser Micro-Cut Thermal Conductive Pads - Indium Foil

Ultracompact and miniaturized products suffer from serious heat problems. It is critical to exploit the high thermal conductivity of indium foil to solve the above problem. Hortech employs highly efficient laser to cut indium foil that can speed up thermal conductivity and lower the cost.

Product Features
  • Laser precision cutting.
  • Unique shaping of thermal conductive pads.
  • Low thermal conductive effect.
Applications
  • Laser micro-cutting for metal strips / pads.
  • Laser micro-cutting for spacers.
  • Laser micro-cutting for thermal conductive pads.

Laser Micro-cut Thermal Conductive Indium Foil in Processors | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-cut Thermal Conductive Indium Foil in Processors, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.