PI Micro-Perforation, PI Micro-Drilling / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employ laser micro-drilling in a specific zone for subsequent back-end processing in the unshielded zone of the PI material / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Micro-Drilled and Micro-cut, Shielded PI - Employ laser micro-drilling in a specific zone for subsequent back-end processing in the unshielded zone of the PI material
  • Micro-Drilled and Micro-cut, Shielded PI - Employ laser micro-drilling in a specific zone for subsequent back-end processing in the unshielded zone of the PI material

Micro-Drilled and Micro-cut, Shielded PI

PI Micro-Perforation, PI Micro-Drilling

Micro-drilling and micro-cutting PI materials can stand against thermal expansion. They are particularly suited to patterns in fixed size. They are open to various applications. Hortech exploits PI materials’ high stability and employs laser micro-drilling for high-precision perforation in the shielded zone. This allows the unshielded zone to be finished by back-end processes.

Shielded PI Sheets

PI materials are highly stable. Thus, masking patterns will be exhibited after they are finished by laser techniques. Hortech employs laser micro-cutting in the zone that will be finished by back-end processes to produce patterns.

Product Features
  • Can employ high-precision finishing
  • PI materials are stable, easy to obtain, and the cost is low
  • Can replace the masking process. Additionally, the design is highly flexible.
Applications
  • Shielded sheets for dry micro-etching.
  • As a substitute for masking.
  • Medical perforated PI sheets.
  • Inkjet nozzle plates.

Micro-Drilled and Micro-cut, Shielded PI | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Micro-Drilled and Micro-cut, Shielded PI, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.