Laser Cutting Flexible Circuit Boards / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Cold laser micro-cutting for flexible PI circuit boards / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser Cutting PI Substrates - Cold laser micro-cutting for flexible PI circuit boards
  • Laser Cutting PI Substrates - Cold laser micro-cutting for flexible PI circuit boards

Laser Cutting PI Substrates

Laser Cutting Flexible Circuit Boards

Applications of flexible circuit boards have become more diverse as the popularity of products with curved surfaces increases. Flexible circuit boards not only help reduce product weights, but also satisfy organizing needs. Furthermore, they help design products in unique shapes. It is simple to assemble and integrate different components with flexible circuit boards. It is difficult to employ traditional die cutting for PI circuit boards. The cost is high as well. Low yield comes with mass production. Hortech employs laser micro-cutting, a cold finishing process that best suits miniaturized flexible circuit boards, to cut PI substrates. This process allows trials and then mass production. As well, it helps achieve high quality and reduce the cost.

Laser micro-cutting for Flexible PI Boards

PI is frequently used to fabricate flexible circuit boards. It is particularly suited to manufacture miniaturized and ultracompact products or those in heterotypic shapes. Traditional cutting suffers from the high cost of molding and burrs. Additionally, the shapes it can produce are limited. In contrast, the ultra-fast laser that Hortech employs is a cold finishing process that does not generate thermal effects. It is a mature, cost-effective technique that only produces little burr when it comes to finishing flexible PI circuit boards.

Product Features
  • Cutting in any shapes.
  • No dust.
  • No burrs.
Applications
  • Flexible PI circuit boards.
  • PI shields.
  • Medical PI filters.

Laser Cutting PI Substrates | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Cutting PI Substrates, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.