Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Ultrafast DUV Laser with Large Power - Thin Wafer-dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

The laser with DUV wavelength can gasify and lift off the material by extremely high photon energy. In addition, the picosecond laser can perform cold processing. Thus, thermal stress will not be generated in the micro-cutting process. This solution is particularly suited to thin wafer-dicing. Hortech Co. is a high-quality Ultrafast DUV Laser with Large Power - Thin Wafer-dicing, Employing DUV laser to cut thin wafers results in low stress and low thermal effects manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Wafer dicing, wafer laser micro-cutting, Si wafer, silicon wafer, cold processing, cold manufacturing / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employing DUV laser to cut thin wafers results in low stress and low thermal effects / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Ultrafast DUV Laser with Large Power - Thin Wafer-dicing - Employing DUV laser to cut thin wafers results in low stress and low thermal effects
  • Ultrafast DUV Laser with Large Power - Thin Wafer-dicing - Employing DUV laser to cut thin wafers results in low stress and low thermal effects

Ultrafast DUV Laser with Large Power - Thin Wafer-dicing

Wafer dicing, wafer laser micro-cutting, Si wafer, silicon wafer, cold processing, cold manufacturing

The laser with DUV wavelength can gasify and lift off the material by extremely high photon energy. In addition, the picosecond laser can perform cold processing. Thus, thermal stress will not be generated in the micro-cutting process. This solution is particularly suited to thin wafer-dicing.

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Employ DUV laser to direct cut thin wafers with low thermal effects


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Ultrafast DUV Laser with Large Power - Thin Wafer-dicing | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Ultrafast DUV Laser with Large Power - Thin Wafer-dicing, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.