Display Backend Processes / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

This deep ultraviolet laser machine adheres the MicroLED thin films to the sapphire wafers and irradiates the deep ultraviolet lasers to dissociate these films. These films will not be sticky and will be lift-off. They will fall down on carrier materials. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Deep Ultraviolet Laser Machine with Large Power for MicroLED Lift-off - This deep ultraviolet laser machine adheres the MicroLED thin films to the sapphire wafers and irradiates the deep ultraviolet lasers to dissociate these films. These films will not be sticky and will be lift-off. They will fall down on carrier materials.
  • Deep Ultraviolet Laser Machine with Large Power for MicroLED Lift-off - This deep ultraviolet laser machine adheres the MicroLED thin films to the sapphire wafers and irradiates the deep ultraviolet lasers to dissociate these films. These films will not be sticky and will be lift-off. They will fall down on carrier materials.

Deep Ultraviolet Laser Machine with Large Power for MicroLED Lift-off

Display Backend Processes

MicroLED displays are produced to replace outdated displays because the latter consumes more energy. This includes the screen displays of smartphones, virtual and augmented reality, vehicles and airplanes. MicroLED saves energy. This deep ultraviolet laser machine can perform lift-off and therefore can be used to transfer the carriers of MicroLED wafers. It is particularly suited to the backend packaging process of MicroLED.


Deep Ultraviolet Laser Machine with Large Power for MicroLED Lift-off | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Deep Ultraviolet Laser Machine with Large Power for MicroLED Lift-off, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.