Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Wafer Laser Micro-engraving | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Before processing semiconductor wafers, it is necessary to precisely engrave the SEMI OCR fonts on wafers for processing stops to correctly identify and trace each wafer. The engraving quality is crucial. In this case, Hortech adopts process optimization and precise positioning to ensure the quality of the outcome. The contrast of the font is clear, and the engraving depth is steady. Moreover, there is no internal stress causing damage to the wafer. Hortech Co. is a high-quality Wafer Laser Micro-engraving, Employ the laser to engrave SEMI fonts in the precise position on the wafer manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Precision SEMI font engraving on semiconductor wafers / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Employ the laser to engrave SEMI fonts in the precise position on the wafer / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Wafer Laser Micro-engraving - Employ the laser to engrave SEMI fonts in the precise position on the wafer
  • Wafer Laser Micro-engraving - Employ the laser to engrave SEMI fonts in the precise position on the wafer

Wafer Laser Micro-engraving

Precision SEMI font engraving on semiconductor wafers

Before processing semiconductor wafers, it is necessary to precisely engrave the SEMI OCR fonts on wafers for processing stops to correctly identify and trace each wafer. The engraving quality is crucial. In this case, Hortech adopts process optimization and precise positioning to ensure the quality of the outcome. The contrast of the font is clear, and the engraving depth is steady. Moreover, there is no internal stress causing damage to the wafer.

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Laser Micro-Engraving on Wafer

Laser micro-engraving on semiconductor wafers needs to comply with the shapes and dimensions specified by the SEMI M12 / M13 standard. Laser micro-etching is employed to engrave on the wafer.

Product Features
  • High quality laser micro-engraving.
  • Precise positioning.
Applications
  • Wafer engraving.
  • Production resumes for optical die / molds.

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Wafer Laser Micro-engraving | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Wafer Laser Micro-engraving, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.