Purchase Laser Micro-Cutting | Laser Processing Services & Custom Designed Machines Manufacturer

Purchase Laser Micro-Cutting | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Hortech Co. is a high-quality Laser Micro-Cutting, Micron laser processing, precision laser processing, laser etching, laser cutting, laser drilling, laser engraving, laser machines, laser equipment, wafer dicing, wafer drilling manufacturer from Taiwan since 2006. Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

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Laser Micro-cutting Fingerprint IC Substrates

To cut fingerprint IC substrates, Hortech coats substrates with protective films to reduce...

Laser Curve-Cutting on Flexible Explosion-proof Films

Many devices, equipment, and gears demand curved surfaces, including wearable devices, AR/VR/MR/XR...

Laser Micro-cutting Plastic Nozzles

General or optical plastic injection manufacturers need their sprues / nozzles to be cut. Traditional...

Laser Micro-cutting Composite Carbon Fiber/Ceramic Fiber/Glass Fiber in Heterotypic Shapes

Composite materials, including ceramic fiber and carbon fiber, are light and hard. They could...

Complex Waterjet Laser CNC Machine

Hortech works with an European manufacturer to launch the waterjet laser CNC machine. This...

Ultrafast SiC Wafer Dicing Laser Machine

Hortech has successfully developed the precision laser machine that can dice SiC wafers at high...

Laser Micro-cutting System for Flexible Substrates

This laser micro-cutting system for flexible substrates is designed to cut flexible materials...

Deep Ultraviolet Laser Machine with Large Power for Wafer-dicing

This laser machine employs DUV ultrashort pulses to remove the protective films or liquid of composites...

Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites

This machine adopts the deep ultraviolet lasers with short pulses to gasify materials immediately...

Result 25 - 33 of 33

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Laser Micro-Cutting | Taiwan Laser Processing Services & Laser Engraving Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-Cutting, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.