Hortech Company - Hortech Co. - Professional provider of precision laser equipment and micron laser solution.

Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

This machine adopts the deep ultraviolet lasers with short pulses to gasify materials immediately without producing thermal effects. You may use it to perform high-quality cold processing. Multi-layered composite materials absorb deep ultraviolet lasers to a great extent. These lasers do not pass through materials easily. Therefore, they can gasify and gradually remove materials by micro-etching. You can control the cutting to achieve the depth you specify. Using this machine to micro-cut multi-layered composites by laser micro-etching does not generate thermal stress and hot melting. It helps arrive at ultra-precision micro-cutting and edge micro-etching. This machine is well-suited for manufacturers in the semiconductor, medicine, automotive, and display panel industries. It enhances both productivity and efficiency in critical processes. Hortech Co. is a high-quality Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites, This deep ultraviolet machine can perform the whole-cut and semi-cut/half-cut processes. You can use it to gradually cut multi-layered composites by laser micro-etching to achieve the depth you prefer. manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser micro-cutting for multi-layered composites, laser micro-cutting achieved by laser micro-etching, circuit laser micro-etching / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

This deep ultraviolet machine can perform the whole-cut and semi-cut/half-cut processes. You can use it to gradually cut multi-layered composites by laser micro-etching to achieve the depth you prefer. / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites - This deep ultraviolet machine can perform the whole-cut and semi-cut/half-cut processes. You can use it to gradually cut multi-layered composites by laser micro-etching to achieve the depth you prefer.
  • Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites - This deep ultraviolet machine can perform the whole-cut and semi-cut/half-cut processes. You can use it to gradually cut multi-layered composites by laser micro-etching to achieve the depth you prefer.

Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites

Laser micro-cutting for multi-layered composites, laser micro-cutting achieved by laser micro-etching, circuit laser micro-etching

This machine adopts the deep ultraviolet lasers with short pulses to gasify materials immediately without producing thermal effects. You may use it to perform high-quality cold processing. Multi-layered composite materials absorb deep ultraviolet lasers to a great extent. These lasers do not pass through materials easily. Therefore, they can gasify and gradually remove materials by micro-etching. You can control the cutting to achieve the depth you specify. Using this machine to micro-cut multi-layered composites by laser micro-etching does not generate thermal stress and hot melting. It helps arrive at ultra-precision micro-cutting and edge micro-etching. This machine is well-suited for manufacturers in the semiconductor, medicine, automotive, and display panel industries. It enhances both productivity and efficiency in critical processes.

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Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Deep Ultraviolet Laser Machine with Large Power for Micro-cutting Multi-layered Composites, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.