• 雷射技術

    Laser Color marking

    Smartphone

    Grating color marking

    <2um laser line width

  • Laser Trimming

    Computer

    RAM Laser Trimming

    Ohm tolerance<1%

  • Laser micro marking

    Smartphone

    Micro 2D code

    2D Code Micro-marking 7 μm dots in

    0.3mm x 0.3mm area with 140 characters

  • Laser dry etching

    Semi/smartphone

    Laser etching ITO on BM glass

    <10um isolation line-width on thin film

  • Laser thin film patterning

    DITO Touch Panel

    Single Glass (0.42mm)dual side ITO touch panel module

    Isolation line width <6um

  • Laser thick film writing

    Smartphone touch panel

    Silver plastic narrow border

    isolation line width < 10 um

  • Laser micro structure(2D/3D)

    light guide

    3D Surface structure

    <50um blind holes

    Mold

    Surface structure

    <10um line-width

    smartphone

    Bonding metal and plastic

    anchor on Surface structure

  • Laser cutting

    Smartphone harden Glass

    Laser cutting (Bessel optic)

    <5um line width chipping<10um, Ra<1um

    LED/smartphone Sapphire

    Laser cutting (Bessel Optic)

    chipping<10um. Ra<1um

    LCD/3C

    Laser engraving for drilling

    Laser engraving for drilling

    Semi

    EMC cutting

    Cut through and no thermal effect

    LCD

    Polarizer cutting

    <50um thermal effect

    Fiber Communication

    Copper tube cutting

    Cut 40um thickness copper without thermal effect

    OLED

    YAG混粉 powder cut

    <5um cut width, no thermal effect

    Semi

    Laser full cut Si wafer 100um thickness

    <30um cut width, total effect <100um

  • Laser Micro Scribing

    OLED Display

    Laser semi-cut PI/PET

    <10um semi-cut

    Thin film PV/organic PV

    Laser scribing Silver paste

    <10um etching silver paste on glass

    LED

    Laser scribing sapphire

    Cut depth >60um line width, 24um

    Optic

    Grating or fresnel

    <10um surface structure

  • Laser Micro drilling hole

    Electronic ceramic

    Oscillator

    <20um Soft ceramic blind hole on PET

    PCB

    PI probe card

    <100um Micro hole on PI

    Micro-LED

    Blind hole/structure

    <100um Micro blind hole on stainless

    Semi

    probe card

    <30um Micro hole on ceramic

  • Laser lift-off

    Flexible PCB/Display

    Lift off

    257-355nm fs/ps/ns laser