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Laser Heterotypic Cutting on Silicon Wafer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these to produce components in heterotypic shapes. These materials need to be processed and patterned, including various shapes, holes, or grooves, etc. Hortech Co. is a high-quality Laser Heterotypic Cutting on Silicon Wafer, Cutting silicon wafers and pattern production for mechanical components manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

The production of silicone components for machines, wafer dicing, wafer laser micro-cutting, laser cutting / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Cutting silicon wafers and pattern production for mechanical components / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser Heterotypic Cutting on Silicon Wafer - Cutting silicon wafers and pattern production for mechanical components
  • Laser Heterotypic Cutting on Silicon Wafer - Cutting silicon wafers and pattern production for mechanical components

Laser Heterotypic Cutting on Silicon Wafer

The production of silicone components for machines, wafer dicing, wafer laser micro-cutting, laser cutting

Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these to produce components in heterotypic shapes. These materials need to be processed and patterned, including various shapes, holes, or grooves, etc.

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Silicon Mechanical Components

Silicon wafers are mainly used to design and manufacture mechanical components. Laser technologies help simplify advanced semiconductor processes, such as etching, cutting, or drilling.

Product Features
  • Fast and mature finishing processes.
  • High flexibility in designing the size and precision of silicon components.
  • The shape produced by laser cutting is smooth and flat.
Applications
  • Silicon spacers.
  • Inkjet heads.
  • Plated through holes (PTH) / Via holes.

Products

Hortech's Catalog - Waterjet Laser Machine

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Laser Consultation

Technical advising.

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Laser Heterotypic Cutting on Silicon Wafer | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Heterotypic Cutting on Silicon Wafer, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.