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Wire Peeling/Trimming | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

High-quality wires consist of multi-layered materials. It is difficult to employ the conventional mechanical peeling to finish high-frequency wires. Hortech employs multiple types of lasers to peel different layers, including laser micro-etching for peeling organic insulation materials, layer micro-cutting for aluminum removal, etc. Hortech Co. is a high-quality Wire Peeling/Trimming, Exploit the wavelength or threshold of the laser to remove the exterior organic insulation materials manufacturer from Taiwan since 2006. Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Laser micro-etched multilayered materials / Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Exploit the wavelength or threshold of the laser to remove the exterior organic insulation materials / Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

Wire Peeling/Trimming - Exploit the wavelength or threshold of the laser to remove the exterior organic insulation materials
  • Wire Peeling/Trimming - Exploit the wavelength or threshold of the laser to remove the exterior organic insulation materials

Wire Peeling/Trimming

Laser micro-etched multilayered materials

High-quality wires consist of multi-layered materials. It is difficult to employ the conventional mechanical peeling to finish high-frequency wires. Hortech employs multiple types of lasers to peel different layers, including laser micro-etching for peeling organic insulation materials, layer micro-cutting for aluminum removal, etc.

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Laser Peeled Wires

Many high-frequency wires need to be finished by this laser peeling process. Hortech designs the processes based on how a specific material absorbs the wavelength of the laser to peel the wire without damaging the interior metal layer. Precise positioning helps accurately peel the wire according to the client’s request.

Product Features
  • Precise positioning.
  • Neat and stable peeling.
  • The internal layers are not damaged.
Applications
  • High frequency wires.
  • Thin wires.

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Hortech's Catalog - Waterjet Laser Machine

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Wire Peeling/Trimming | Laser Engraving & Micro Cutting Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Wire Peeling/Trimming, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.