Laser Micro-Cutting Searched | Laser Processing Services & Custom Designed Machines Manufacturer | Hortech Co.

Self-developed, patented precision laser systems and machines, optimal processes, integrated laser and optic-mechatronic technologies.

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Laser Micro-Cutting Light-Guiding Plates for Vehicles
Laser Micro-Cutting Light-Guiding Plates for Vehicles

Hortech employs the laser micro-cutting solution to mass produce optical light guide plates...

Laser Burr-trimming Optical Plastic Components
Laser Burr-trimming Optical Plastic Components

Burrs of optical plates are generated in the traditional injection molding process. This affects...

Laser Micro-cutting Injection Molded Optical Plastic Nozzles
Laser Micro-cutting Injection Molded Optical Plastic Nozzles

Various transparent optical materials need to be cut, including light-guiding plates, AR / VR components,...

Seamless Laser Micro-cutting Glass MicroLED Substrates
Seamless Laser Micro-cutting Glass MicroLED Substrates

To cut MicroLED glass substrates, Hortech employs micron focused laser beams with a long depth...

Laser Micro-Cutting Flexible Panels
Laser Micro-Cutting Flexible Panels

Hortech employs cold laser finishing to cut organic flexible panels, which achieves high-quality...

Laser Cutting Polarizers in Heterotypic Shapes
Laser Cutting Polarizers in Heterotypic Shapes

Hortech employs the high-energy laser to cut polarizer materials in heterotypic shapes and triggers...

Micro-cutting Biomedical Films
Micro-cutting Biomedical Films

Hortech employs laser precision micro-cutting on biomedical materials to produce microfluidic...

Laser Micro-cutting Nozzles of Plastic Endoscopic Lens
Laser Micro-cutting Nozzles of Plastic Endoscopic Lens

Employing laser micro-cutting to cut sprues / nozzles is different from traditional cutting...

Micro-drilled Medical PET Sensing Strips
Micro-drilled Medical PET Sensing Strips

Laser micro-drilling is employed to process biomedical PET materials. Hortech focuses on the precision...

SiC Wafer Dicing
SiC Wafer Dicing

Hortech has developed the ultrafast laser machine that can implement SiC wafer dicing at high...

Laser Micro-cutting Small Wafers
Laser Micro-cutting Small Wafers

The surface of the wafer must be clean and dust-free after the larger one is cut, so it is crucial...

Laser Heterotypic Cutting on Silicon Wafer
Laser Heterotypic Cutting on Silicon Wafer

Silicon wafers have been widely adopted, so many semiconductor-related industries prefer to use these...

Result 13 - 24 of 33

Laser Micro-Cutting | Taiwan Laser Processing Services & Laser Engraving Machines Manufacturer | Hortech Co.

Located in Taiwan since 2006, Hortech Company has been a manufacturer providing precision laser processing services and custom designed machines. Its core techniques include: Laser Micro-Cutting, laser micro-etching, micro-drilling, micro-cutting, and laser engraving. It has successfully developed products for diverse industries, including optical scales for factory automation and robotics, superfine reticles for the defense industry, and wafer dicing and drilling for the semiconductor industry. Hortech's laser OEM/ODM services have served industrial partners from around the world.

Hortech Company was established by Dr. Owen Chun Hao Li in 2016. It has developed a laser marking system used for the traceability of medical circuit boards for a Taiwanese circuit manufacturer in 2018. It has developed the triple wavelength laser combined machining system for a Singapore manufacturer in 2017. It produced different types of magnetic and optical scales with high accuracy for encoders and actuators since 2019. Hortech kept upgrading its laser machines and expanding its services to different regions. Its rigorous quality control processes ensures its clients' needs are satisfied.

Hortech Co. has been offering customers ultra-precision laser machining services and laser CNC machines since 2006, both with advanced technology and 27 years of experiences, Hortech Co. ensures each customer's demands are met.